• Empowering Industrial 4.0: Challenges and Future Vision
  • ICED 2018 will be on 9 - 10th Aug 2018

  • The 4th INTERNATIONAL CONFERENCE ON ELECTRONIC DESIGN (ICED 2018)
    Empowering Industrial 4.0: Challenges and Future Vision
  • The 4th INTERNATIONAL CONFERENCE ON ELECTRONIC DESIGN (ICED 2018)
    Empowering Industrial 4.0: Challenges and Future Vision
  • The 4th INTERNATIONAL CONFERENCE ON ELECTRONIC DESIGN (ICED 2018)
    Empowering Industrial 4.0: Challenges and Future Vision
  • The 4th INTERNATIONAL CONFERENCE ON ELECTRONIC DESIGN (ICED 2018)
    Empowering Industrial 4.0: Challenges and Future Vision

The 4th INTERNATIONAL CONFERENCE ON ELECTRONIC DESIGN (ICED 2018)

School of Computer and Communication Engineering and School of Microelectronics Engineering, UNIMAP in collaboration with Prince Songkla University, Thailand are pleased to announce that we will be hosting The 4th International Conference on Electronic Design (ICED) 2018 from 9 - 10th Aug 2018 in Bandar Hilir, Melaka with this year theme of “Empowering Industrial 4.0: Challenges and Future Vision”.

The 4th International Conference on Electronic Design (ICED) 2018 is a consequence to the previous conferences successfully held in 2005, 2008, 2014 and 2016. The aim is to provide a platform to professionals, researchers, academicians and industries to share and generate interest in cutting-edge applications, challenges and issues in the area of electronics and computer applications. The theme of the conference this year has been chosen in view of the current revolution and rapid developments in the field of electronics and communication design. Several number of keynote speakers will be invited to share their idea of the current trend in electronic and computer applications.

The applications of electronic and computer in Industrial 4.0 cover a broad area of research domain namely Internet of Thing, cybernetics, big data and analytics and communications. The application of Internet of Thing in Industrial 4.0 can be seen from physical objects to be sensed and controlled remotely across existing network infrastructure, creating opportunities for more direct integration between the physical world and computer-based systems, and resulting in improved efficiency, accuracy and economic benefit. This conference will offer several tracks focusing on future technologies for Industrial 4.0, covering Internet of Thing (IoT), Information and Communication Technology (ICT), green technology/communication technology, industrial electronic design, nanotechnology, biomedical technology, multimedia technology, mobile and wireless communication technologies, wireless sensor networks, system-on-chip (SOC) technology and embedded computing technology.

CONTACT US:
Phone: +6019-5736310/+604-988 5670,
Fax: +604-988 5098
Email: iced2018@unimap.edu.my
Website: http://scce.unimap.edu.my/iced2018

Call For Paper

The 4th International Conference on Electronic Design (ICED 2018) will be held in Bandar Hilir Melaka, Malaysia from 9 - 10th Aug 2018. It aims to provide a platform to Professionals, Researchers, Academicians and Industry personals to share their new research findings. It is also a platform to showcase and generate interest in cutting-edge applications, challenges and future trends in the area of Electronics and Computer Applications for Internet of Things (IoT) with this year theme of “Empowering Industrial 4.0: Challenges and Future Vision”.

The ICED2018 Call for paper can be downloaded here

ALL accepted paper will be published in Journal of Telecommunication, Electronic and Computer Engineering (JTEC) journal; indexed by Scopus

To submit paper to ICED 2018 click here

Conference Track
List of conference tracks are as follows.
1) Embedded Systems & SoC Applications
2) Communication and Antenna design,
3) Network Connectivity & Wireless Sensor
4) Signal and Image processing
5) Industrial Electronics
6) Micro/Nanoelectronics & Bio Chips
7) Analog & Digital Integrated Circuits
8) Application Specific IoT
9) Others


Potential paper are solicited in but are not limited to the following topic
1) Network Embedded Systems
2) Wireless Sensor Network
3) Artificial Intelligence
4) Information Security and Cryptography
5) Telecommunication
6) Software/Hardware Engineering Testing & Reliability
7) Hardware & Architecture
8) Operating System
9) Signal and Image processing
10) Robotic Applications
11) Control System
12) Biomedical & e-Health Systems
13) VLSI
14) System On Chipv 15) Wireless Communications
16) Peer-to-Peer Networking and Cloud-Based Content Distribution
17) Multimedia Networking, Services and Applications
18) Smart Spaces and Sensor Networks
19) Green Communications and Computations
20) Intelligent and Emotion-oriented Computing
21) 3D Imaging, Processing, Communication and Display
22) Embedded Computing
23) Electromagnetic Field Theory
24) Optical Communications and Systems
25) Biomedical Signal Processing
26) Microelectronics Fabrication
27) MEMS and NEMS
28) IC Design
29) Electronic/Microelectronic Fabrication

Important Dates

Event Date
Full Paper Submission 2nd March 2018
Final Date: 30th April 2018
Notification of Acceptance 7th June 2018
Camera Ready/Early Bird Registration 15th June 2018
Registration 1st August 2018
Conference date 9 - 10th Aug 2018

Fees

International Local
Normal USD 400 RM 1,500
Early bird USD 370 RM 1,400
Student USD 350 RM 1,300
None Presenter USD 100 RM 250
* 10% Discount for the second and third paper with the same presenter